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Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025

  • Visit booth #i2326 to connect with our experts on automated fluid dispensing and plasma treatment for semiconductor advanced packaging

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250817149251/en/

Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today’s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today’s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

On display will be the ASYMTEK® Vantage® dispensing system, configured with two ASYMTEK IntelliJet® jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today’s evolving technologies, like panel-level packaging, The Vantage system is already a popular dispenser in wafer-level packaging operations, including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations.

The theme for SEMICON Taiwan 2025, “Leading with Collaboration. Innovating with the World,” will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.

About Nordson Electronics Solutions

Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed.

About Nordson Corporation

Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

High-yield dispensing technologies for panel- and wafer-level advanced packaging on display at SEMICON Taiwan 2025

Contacts

For information:

MAIN OFFICE:

Roberta Foster-Smith

Nordson Electronics Solutions

2762 Loker Ave West

Carlsbad, CA, USA 92010

Tel: +1.760.431.1919

Email: roberta.foster-smith@nordson.com

For information in Taiwan:

Alex Wu

Sales Director, ASYMTEK and SELECT

Nordson Advanced Technology LLC, Taiwan Branch

Tel: +886.932.227.770

Email: alex.wu@nordson.com

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